TY -
BOOK
AU - International Symposium on Interface Structure, Properties and Diffusion Bonding 1 1985 Tokio
AU - Ishida, Yoichi
TI -
Fundamentals of diffusion bonding
proceed. of the 1. Seiken International Symposium on Interface Structure, Properties and Diffusion Bonding, Tokyo, Japan, 2-4 Dec. 1985
PB - Elsevier
SN - 0444428771
KW - Konferenzschrift 1985 Tokio
KW - Konferenzschrift
KW - Diffusionsschweißen
KW - Keramik-Metall-Verbund
PY - 1987
N2 - Literaturangaben
BT - Studies in physical and theoretical chemistry ; 48
BT - Seiken international symposium ; 1
CY - Amsterdam [u.a.]
ER -