TY - BOOK
AU - Lau, John H.
TI - Flip chip technologies
PB - McGraw-Hill
SN - 0070366098
KW - Integrated circuits Very large scale integration Design and construction
KW - Flip chip technology
KW - Multichip modules (Microelectronics) Design and construction
KW - Microelectronic packaging
KW - Engineering (Electronic)
KW - Chip
KW - Herstellung
PY - c 1996
BT - Electronic packaging and interconnection series
CY - New York, NY [u.a.]
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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