TY - BOOK
AU - Yeh, Lian-Tuu
AU - Chu, Richard C.
TI - Thermal management of microelectronic equipment heat transfer theory, analysis methods, and design practices
PB - ASME Press
SN - 0791801683
KW - Electronic apparatus and appliances Cooling
KW - Microelectronics
KW - Electronic apparatus and appliances Thermal properties
KW - Heat Transmission
KW - Semiconductors Protection
KW - Mikroelektronik
KW - Kühlung
KW - Elektronisches Bauelement
KW - Wärmeabgabe
PY - 2002
N2 - Literaturangaben
BT - ASME Press book series on electronic packaging
CY - New York
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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