TY - GEN
AU - Institute of Electrical and Electronics Engineers
TI - IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 12 - 14 December 2011, Hanzhou, China
PB - IEEE
SN - 9781467322881
SN - 1467322881
SN - 146732289X
SN - 9781467322898
KW - Microelectronic packaging Congresses
KW - Electronic packaging Congresses
KW - Konferenzschrift
PY - 2011
N2 - Parallel als Druckausg. erschienen
CY - Piscataway, NJ
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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