TY - GEN
AU - Institute of Electrical and Electronics Engineers
AU - Components, Packaging, and Manufacturing Technology Society Japan Chapter
AU - Sangyō-Gijutsu-Sōgō-Kenkyūsho Tsukuba
AU - Suga, Tadatomo
TI - 2010 IEEE CPMT Symposium Japan 24 - 26 Aug. 2010, Tokyo, Japan ; the International Symposium on Components, Packaging, and Manufacturing Technology ; formerly "VLSI Packaging Workshop Japan"
PB - IEEE
SN - 9781424475940
SN - 1424475937
SN - 9781424475933
KW - Electronic packaging Congresses
KW - Konferenzschrift
PY - 2010
N2 - Literaturangaben
CY - Piscataway, NJ
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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