TY - GEN
AU - Electronics Packaging and Technology Conference 17. 2015 Singapur
AU - Institute of Electrical and Electronics Engineers
AU - Components, Packaging, and Manufacturing Technology Society
TI - 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) 2-4 Dec. 2015
PB - IEEE
SN - 9781467372695
SN - 9781424451005
KW - Electronic packaging Congresses
KW - Konferenzschrift
PY - 2015
N2 - "Conference location: Singapore" - IEEE Xplore
N2 - Literaturangaben
CY - [Piscataway, NJ]
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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