TY - GEN
AU - Schwizer, Jürg
AU - Mayer, Michael
AU - Brand, Oliver
TI - Force Sensors for Microelectronic Packaging Applications
PB - Springer Berlin Heidelberg
SN - 9783540269458
KW - System safety
KW - Electronics
KW - Optical materials
KW - Nanotechnology
KW - Chemistry
KW - Microelectronic packaging
KW - Prozessüberwachung
KW - Kraftsensor
KW - Drahtbonden
KW - Flip-Chip-Technologie
PY - 2005
BT - Microtechnology and MEMS
BT - SpringerLink ; Bücher
CY - Berlin, Heidelberg
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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