author = { Institution of Electrical Engineers Iyer, Subramanian S. AND Auberton-Hervé, Andre J. },

title = { Silicon wafer bonding technology for VLSI and MEMS applications },

publisher = {Institution of Electrical Engineers},

isbn = {0852960395},

keywords = { Silicon-on-insulator technology , Integrated circuits Very large scale integration , Microelectromechanical systems , Silicium , Wafer , Bonden , VLSI , Mikromechanik , SOI-Technik },

year = {2002},

abstract = {Includes bibliographical references and index},

booktitle = {EMIS processing series ; 1},

address = { London },

url = { http://slubdd.de/katalog?TN_libero_mab2 }