author = { Institute of Electrical and Electronics Engineers AND Components, Packaging, and Manufacturing Technology Society },

title = { Electrical Design of Advanced Packaging and Systems Symposium, 2008 EDAPS 2008 ; 10 - 12 Dez. 2008. Seoul, Korea },

publisher = {IEEE},

isbn = {1424426332},

isbn = {9781424426331},

keywords = { Integrated passive components Congresses , Electronic packaging Congresses , Electromagnetic interference Congresses , Signal integrity (Electronics) Congresses , Konferenzschrift },

year = {2008},

abstract = {Parallel als Druckausg. erschienen},

address = { Piscataway, NJ },

url = { http://slubdd.de/katalog?TN_libero_mab2 }