%0 Book
%T Flip chip technologies
%A Lau, John H.
%I McGraw-Hill
%@ 0070366098
%K Integrated circuits Very large scale integration Design and construction
%K Flip chip technology
%K Multichip modules (Microelectronics) Design and construction
%K Microelectronic packaging
%K Engineering (Electronic)
%K Chip
%K Herstellung
%D c 1996
%C McGraw-Hill
%C New York, NY [u.a.]
%U http://slubdd.de/katalog?TN_libero_mab2
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