%0 Generic
%T 2012 2nd IEEE CPMT Symposium Japan 10 - 12 Dec. 2012, Kyoto, Japan ; the International Components, Packaging, and Manufacturing Technology Symposium ; [formerly "VLSI Packaging Workshop Japan"]
%A Institute of Electrical and Electronics Engineers
%A Components, Packaging, and Manufacturing Technology Society
%A Yamada, Hiroshi
%I IEEE
%@ 9781467326551
%@ 1467326550
%@ 1467326542
%@ 9781467326544
%K Electronic packaging Congresses
%K Konferenzschrift
%D 2012
%X Kongr.-Thema: Heterogeneous system integration technology toward the future
%X Auch gezählt als "IEEE 11th VLSI Packaging Workshop in Japan"
%X Literaturangaben
%C IEEE
%C Piscataway, NJ
%U http://slubdd.de/katalog?TN_libero_mab2
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