%0 Generic
%T Force Sensors for Microelectronic Packaging Applications
%A Schwizer, Jürg
%A Mayer, Michael
%A Brand, Oliver
%I Springer Berlin Heidelberg
%@ 9783540269458
%K System safety
%K Electronics
%K Optical materials
%K Nanotechnology
%K Chemistry
%K Microelectronic packaging
%K Prozessüberwachung
%K Kraftsensor
%K Drahtbonden
%K Flip-Chip-Technologie
%D 2005
%C Springer Berlin Heidelberg
%C Berlin, Heidelberg
%U http://slubdd.de/katalog?TN_libero_mab2
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