%0 Generic
%T Characterization of a Bare-Die SiC-Based, Wirebond-Less, Integrated Half-Bridge With Multi-Functional Bus-Bars
%A Park, Yongwan
%A Chakraborty, Shiladri
%A Khaligh, Alireza
%I Institute of Electrical and Electronics Engineers (IEEE)
%@ 2332-7782
%@ 2372-2088
%D 2022
%C Institute of Electrical and Electronics Engineers (IEEE)
%U http://slubdd.de/katalog?TN_libero_mab2
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