@book {TN_libero_mab2,
author
=
{
Lau, John H.
}
,
title
=
{
3D IC integration and packaging
}
,
publisher
=
{
McGraw-Hill
}
,
isbn
=
{
9780071848060
}
,
year
=
{
2016
}
,
address
=
{
New York [u.a.]
}
,
url
=
{
http://slubdd.de/katalog?TN_libero_mab2
}
}
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