author = { Lau, John H. Lee, Shi-Wei Ricky },

title = { Microvias key to low-cost and high-density interconnects },

publisher = {McGraw-Hill},

isbn = {0071363270},

keywords = { Microelectronic packaging , Integrated circuits , Design and construction , Cost control , Semiconductors , Junctions , Printed circuits , Halbleiter , Halbleitergrenzfläche , Integrierte Schaltung , Schaltungsentwurf , Kostenminimum , Mikroelektronik },

year = {2001},

booktitle = {McGraw-Hill professional engineering},

address = { New York [u.a.] },

url = { http://slubdd.de/katalog?TN_libero_mab2 }