TY - BOOK
AU - Lau, John H.
AU - Lee, Shi-Wei Ricky
TI - Microvias key to low-cost and high-density interconnects
PB - McGraw-Hill
SN - 0071363270
KW - Microelectronic packaging
KW - Integrated circuits
KW - Design and construction
KW - Cost control
KW - Semiconductors
KW - Junctions
KW - Printed circuits
KW - Halbleiter
KW - Halbleitergrenzfläche
KW - Integrierte Schaltung
KW - Schaltungsentwurf
KW - Kostenminimum
KW - Mikroelektronik
PY - 2001
BT - McGraw-Hill professional engineering
CY - New York [u.a.]
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
Download citation