%0 Book
%T Application of fracture mechanics in electronic packaging [contains 23 technical papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging] ; presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
%A American Society of Mechanical Engineers
%A American Society of Mechanical Engineers Applied Mechanics Division
%A International Mechanical Engineering Congress and Exposition 1997 Dallas, Tex
%A Symposium on Application of Fracture Mechanics in Electronic Packaging 1997 Dallas, Tex
%A Chen, William T.
%I American Soc. of Mechanical Engineers
%@ 0791818276
%K Konferenzschrift
%D 1997
%C American Soc. of Mechanical Engineers
%C New York, NY
%U http://slubdd.de/katalog?TN_libero_mab2
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