TY -
BOOK
AU - Dziuban, Jan A.
TI -
Bonding in microsystem technology
PB - Springer Netherland
SN - 9781402045783
SN - 1402045786
KW - Microtechnology
KW - Micromachining
KW - Mikrosystemtechnik
KW - Bonden
PY - 2006
N2 - Literaturangaben
BT - Springer series in advanced microelectronics ; 24
CY - Berlin [u.a.]
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -