%0 Book
%T Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
%A Liu, Sheng
%A Liu, Yong
%7 1. publ.
%I Wiley
%I : Chemical Industry Press
%@ 0470827807
%@ 9780470827802
%K Microelectronic packaging Simulation methods
%D 2011
%D , 2011
%X Includes bibliographical references and index
%C Wiley
%C : Chemical Industry Press
%C Singapore
%C ; [Beijing]
%U http://slubdd.de/katalog?TN_libero_mab2
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