author = { Li, Yan AND Deepak, Goyal AND Goyal, Deepak },

title = { 3D microelectronic packaging from fundamentals to applications },

publisher = {Springer International Publishing AG},

publisher = {},

isbn = {9783319445847},

keywords = { Mikroelektronik },

year = {[2017]},

year = {, © 2017},

abstract = {Literaturangaben},

booktitle = {Springer series in advanced microelectronics ; Volume 57},

address = { Cham , },

url = { http://slubdd.de/katalog?TN_libero_mab2 }