%0 Book
%T 3D microelectronic packaging from fundamentals to applications
%A Li, Yan
%A Deepak, Goyal
%A Goyal, Deepak
%I Springer International Publishing AG
%@ 9783319445847
%K Mikroelektronik
%D [2017]
%D , © 2017
%X Literaturangaben
%C Springer International Publishing AG
%C Cham
%U http://slubdd.de/katalog?TN_libero_mab2
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