TY - BOOK

AU - Li, Yan

AU - Deepak, Goyal

AU - Goyal, Deepak

TI - 3D microelectronic packaging from fundamentals to applications

PB - Springer International Publishing AG

SN - 9783319445847

KW - Mikroelektronik

PY - [2017]

N2 - Literaturangaben

BT - Springer series in advanced microelectronics ; Volume 57

CY - Cham

UR - http://slubdd.de/katalog?TN_libero_mab2

ER -