TY -
GEN
AU - Reinicke, Marco
TI -
Investigation of physical and chemical interactions during etching of silicon in dual frequency capacitively coupled HBr/NF3 gas discharges
KW - Dynamisches RAM
KW - Silicium
KW - Wafer
KW - Plasmaätzen
KW - Gasentladung
KW - Hochschulschrift
PY - 2009
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -