TY - GEN
AU - Bochmann, Helge
AU - Heckel, Benedikt von
AU - Maas, Jürgen
TI - Investigation and enhancement of the adhesion properties for an optimized lamination of DE multilayer stack-transducers
PB - IOP Publishing
SN - 0964-1726
SN - 1361-665X
KW - Electrical and Electronic Engineering
KW - Mechanics of Materials
KW - Condensed Matter Physics
KW - General Materials Science
KW - Atomic and Molecular Physics, and Optics
KW - Civil and Structural Engineering
KW - Signal Processing
PY - 2016
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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