author = { Baldwin, D.F. AND Deshmukh, R.D. AND Hau, C.S. },

title = { Gallium alloy interconnects for flip-chip assembly applications },

publisher = {Institute of Electrical and Electronics Engineers (IEEE)},

isbn = {1521-3331},

keywords = { Electrical and Electronic Engineering , Electronic, Optical and Magnetic Materials },

year = {2000},

url = { http://slubdd.de/katalog?TN_libero_mab2 }