TY - GEN
AU - Wu, Na
AU - Hu, Yongfang
AU - Sun, Shufeng
TI - Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs
PB - MDPI AG
SN - 1996-1944
KW - General Materials Science
PY - 2020
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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