TY -
BOOK
AU - Bakir, Muhannad S.
AU - Sitaraman, Suresh K.
TI -
Flexible chip I/O interconnects
PB - World Scientific Publishing Co. Pte. Ltd.
SN - 9811201145
SN - 9789811201141
PY - [2020]
N2 - Literaturangaben
BT - Encyclopedia of packaging materials, processes, and mechanics / editor-in-chief: Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay ; set 1 ; Interconnect and wafer bonding technology ; vol. 3
CY - Singapore
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -