TY - GEN
AU - Jiguet, S.
AU - Judelewicz, M.
AU - Mischler, S.
AU - Bertch, A.
AU - Renaud, P.
TI - Effect of filler behavior on nanocomposite SU8 photoresist for moving micro-parts
PB - Elsevier BV
SN - 0167-9317
KW - Electrical and Electronic Engineering
KW - Surfaces, Coatings and Films
KW - Condensed Matter Physics
KW - Atomic and Molecular Physics, and Optics
KW - Electronic, Optical and Magnetic Materials
PY - 2006
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
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