TY - GEN
AU - Kobayashi, Yoshio
TI - Microwave and Millimeter-Wave Evaluation of Copper-Clad Dielectric Substrates
PB - Japan Institute of Electronics Packaging
SN - 1343-9677
SN - 1884-121X
KW - Electrical and Electronic Engineering
PY - 2015
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
Download citation