TY - GEN
AU - Oba, Yoshiyuki
AU - De Messemaeker, Joke
AU - Tyrovouzi, Anna Maria
AU - Miyamori, Yuichi
AU - De Vos, Joeri
AU - Wang, Teng
AU - Beyer, Gerald
AU - Beyne, Eric
AU - De Wolf, Ingrid
AU - Croes, Kristof
TI - Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices
PB - IOP Publishing
SN - 0021-4922
SN - 1347-4065
KW - General Physics and Astronomy
KW - Physics and Astronomy (miscellaneous)
KW - General Engineering
PY - 2015
UR - http://slubdd.de/katalog?TN_libero_mab2
ER -
Download citation