@book
{TN_libero_mab2,
author = {
Bakir, Muhannad S.
AND
Sitaraman, Suresh K.
},
title = {
Flexible chip I/O interconnects
},
publisher = {World Scientific Publishing Co. Pte. Ltd.},
isbn = {9811201145},
isbn = {9789811201141},
year = {[2020]},
abstract = {Literaturangaben},
booktitle = {Encyclopedia of packaging materials, processes, and mechanics / editor-in-chief: Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay ; set 1 ; Interconnect and wafer bonding technology ; vol. 3},
address = {
Singapore
},
url = {
http://slubdd.de/katalog?TN_libero_mab2
}
}