author = { Liu, Yong },

title = { Power electronic packaging design, assembly process, reliability and modeling },

publisher = {Springer},

isbn = {1461410525},

isbn = {9781461410522},

keywords = { Electronic packaging , Power electronics , Elektronisches Bauelement , Bestücken , Durchschlagfestigkeit , Elektrisches Bauelement , Design , Thermodynamische Eigenschaft },

year = {2012},

abstract = {Literaturangaben},

booktitle = {Electrical engineering},

address = { New York },

url = { http://slubdd.de/katalog?TN_libero_mab2 }