%0 Generic
%T Investigations on a Packaging Technology for PCB Integrated Power Electronics
%A Randoll, Richard Georg
%A Frey, Lothar
%A Lang, Klaus-Dieter
%I Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU)
%K Power Electronics
%K Lifetime
%K Sinter
%K printed circuit board
%K PCB
%K power cycling
%K Conductive Anodic Filament
%K galvanic copper
%K pick and place
%K thermal impedance
%D 2018
%C Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU)
%C Erlangen
%U http://slubdd.de/katalog?TN_libero_mab2
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