%0 Generic
%T Co‐design of micro‐fluidic heat sink and thermal through‐silicon‐vias for cooling of three‐dimensional integrated circuit
%A Shi, Bing
%A Srivastava, Ankur
%A Bar‐Cohen, Avram
%I Institution of Engineering and Technology (IET)
%@ 1751-858X
%@ 1751-8598
%D 2013
%C Institution of Engineering and Technology (IET)
%U https://katalog.slub-dresden.de/en/?cHash=d436d54d7a76fc6fe03d5b8c85ebf4cf&tx_find_find%5Baction%5D=citation&tx_find_find%5Bcontroller%5D=Search&tx_find_find%5Bid%5D=ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuMTA0OS9pZXQtY2RzLjIwMTMuMDAyNg&tx_find_find%5Btype%5D=endnote
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