%0
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%T
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology
%A Van der Plas, Geert
%A Limaye, Paresh
%A Loi, Igor
%A Mercha, Abdelkarim
%A Oprins, Herman
%A Torregiani, Cristina
%A Thijs, Steven
%A Linten, Dimitri
%A Stucchi, Michele
%A Katti, Guruprasad
%A Velenis, Dimitrios
%A Cherman, Vladimir
%A Vandevelde, Bart
%A Simons, Veerle
%A De Wolf, Ingrid
%A Labie, Riet
%A Perry, Dan
%A Bronckers, Stephane
%A Minas, Nikolaos
%A Cupac, Miro
%A Ruythooren, Wouter
%A Van Olmen, Jan
%A Phommahaxay, Alain
%A de Potter de ten Broeck, Muriel
%A Opdebeeck, Ann
%A Rakowski, Michal
%A De Wachter, Bart
%A Dehan, Morin
%A Nelis, Marc
%A Agarwal, Rahul
%A Pullini, Antonio
%A Angiolini, Federico
%A Benini, Luca
%A Dehaene, Wim
%A Travaly, Youssef
%A Beyne, Eric
%A Marchal, Paul
%I Institute of Electrical and Electronics Engineers (IEEE)
%@ 0018-9200
%@ 1558-173X
%K Electrical and Electronic Engineering
%D 2011
%C Institute of Electrical and Electronics Engineers (IEEE)
%U https://katalog.slub-dresden.de/en/?cHash=d436d54d7a76fc6fe03d5b8c85ebf4cf&tx_find_find%5Baction%5D=citation&tx_find_find%5Bcontroller%5D=Search&tx_find_find%5Bid%5D=ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuMTEwOS9qc3NjLjIwMTAuMjA3NDA3MA&tx_find_find%5Btype%5D=endnote