%0 Generic
%T Microwave and Millimeter-Wave Evaluation of Copper-Clad Dielectric Substrates
%A Kobayashi, Yoshio
%I Japan Institute of Electronics Packaging
%@ 1343-9677
%@ 1884-121X
%K Electrical and Electronic Engineering
%D 2015
%C Japan Institute of Electronics Packaging
%U http://slubdd.de/katalog?TN_libero_mab2
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