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  1. Ulrich, Richard K. [Editor]

    Advanced electronic packaging - [2. ed.]

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    Hoboken, NJ [u.a.]: Wiley-Interscience, 2006

    Published in: IEEE Press series in microelectronic systems

  2. Minges, Merrill L. [Editor] ; ASM International Handbook Committee

    Electronic materials handbook

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    Materials Park, Ohio, 19XX-