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  1. Lau, John H. [Author]

    3D IC integration and packaging

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    New York [u.a.]: McGraw-Hill, 2016

  2. Tan, Cher Ming [Author]

    Electromigration in ULSI interconnections

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    New Jersey, NJ [u.a.]: World Scientific, 2010

    Published in: International series on advances in solid state electronics and technology

  3. Piguet, Christian [Editor] ; International Federation for Information Processing Working Group Design and Engineering of Electronic Systems, VLSI-SoC 16 2008 Rodos

    VLSI-SoC: design methodologies for SoC and SiP : 16th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2008, Rhodes Island, Greece, October 13 - 15, 2008 ; revised selected papers

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    Berlin; Heidelberg [u.a.]: Springer, 2010

    Published in: International Federation for Information Processing: IFIP advances in information and communication technology ; 313