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  1. Schlag, Leslie [Author] ; Jacobs, Heiko O. [Degree supervisor]; Bund, Andreas [Degree supervisor]; Elshof, Johan ten [Degree supervisor] Technische Universität Ilmenau

    Fundamentals and applications of gas phase electrodeposition

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    Ilmenau: Universitätsbibliothek, [2024?]

  2. Fang, Jun [Other]; Park, Se-Chul [Other]; Schlag, Leslie [Other]; Stauden, Thomas [Other]; Pezoldt, Jörg [Other]; Jacobs, Heiko O. [Other]

    Active matrix-based collection of airborne analytes: an analyte recording chip providing exposure history and finger print

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    2014

    Published in: Advanced materials ; 26(2014), 45, Seite 7600-7607

  3. Schlag, Leslie [Author]; Isaac, Nishchay Angel [Author]; Nahrstedt, Helene [Author]; Reiprich, Johannes [Author]; Ispas, Adriana [Author]; Stauden, Thomas [Author]; Pezoldt, Jörg [Author]; Bund, Andreas [Author]; Jacobs, Heiko O. [Author]

    Nanoparticle gas phase electrodeposition: fundamentals, fluid dynamics, and deposition kinetics

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    2021

    Published in: Journal of aerosol science ; 151(2021) vom: Jan., Artikel-ID 105652, Seite 1-15

  4. Schlag, Leslie [Author]; Isaac, Nishchay Angel [Author]; Hossain, Mohammad M. [Author]; Hess, Anna-Lena [Author]; Wolz, Benedikt C. [Author]; Reiprich, Johannes [Author]; Ziegler, Mario [Author]; Pezoldt, Jörg [Author]; Jacobs, Heiko O. [Author]

    Self-aligning metallic vertical interconnect access formation through microlensing gas phase electrodeposition controlling airgap and morphology

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    2023

    Published in: Advanced electronic materials ; 9(2023), 1, Artikel-ID 2200838, Seite 1-8

  5. Isaac, Nishchay Angel [Author]; Schlag, Leslie [Author]; Ispas, Adriana [Author]; Reiprich, Johannes [Author]; Soydan, Alper K. [Author]; Moreira, Pedro H. O. [Author]; Thiele, Sebastian [Author]; Aliabadian, Bardia [Author]; Flock, Dominik [Author]; Knauer, Andrea [Author]; Jiménez, Juan J. [Author]; Bund, Andreas [Author]; Morales Sánchez, Francisco Miguel [Author]; Pezoldt, Jörg [Author]; Jacobs, Heiko O. [Author]

    Novel gas phase route toward patterned deposition of sputter-free Pt/Al nanofoils

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    [8 July 2023]

    Published in: Advanced Materials Technologies ; 8(2023), 18, Artikel-ID 2300448, Seite 1-8

  6. Isaac, Nishchay Angel [Author]; Reiprich, Johannes [Author]; Schlag, Leslie [Author]; Moreira, Pedro H. O. [Author]; Baloochi, Mostafa [Author]; Raheja, Vishal Amarbhai [Author]; Hess, Anna-Lena [Author]; Centeno, Luis F. [Author]; Ecke, Gernot [Author]; Pezoldt, Jörg [Author]; Jacobs, Heiko O. [Author]

    Three-dimensional platinum nanoparticle-based bridges for ammonia gas sensing

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    2021

    Published in: Scientific reports ; 11(2021) vom: 15. Juni, Artikel-ID 12551, Seite 1-9

  7. Morris, Leslie; Schlag, Evelyn

    Der Schnabelberg

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    JSTOR, 1994

    Published in: World Literature Today

  16. Grasby, Katrina L [Author]; Jahanshad, Neda [Author]; Shatokhina, Natalia [Author]; Mirza-Schreiber, Nazanin [Author]; Moreira, Jose C V [Author]; Mühleisen, Thomas W [Author]; Müller-Myhsok, Bertram [Author]; Najt, Pablo [Author]; Nakahara, Soichiro [Author]; Nho, Kwangsik [Author]; Olde Loohuis, Loes M [Author]; Orfanos, Dimitri Papadopoulos [Author]; Pearson, John F [Author]; Zsembik, Leo C P [Author]; Pitcher, Toni L [Author]; Pütz, Benno [Author]; Quidé, Yann [Author]; Ragothaman, Anjanibhargavi [Author]; Rashid, Faisal M [Author]; Reay, William R [Author]; Redlich, Ronny [Author]; Reinbold, Céline S [Author]; Repple, Jonathan [Author]; Richard, Geneviève [Author]; [...]

    The genetic architecture of the human cerebral cortex

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    Assoc.73085, 2020

    Published in: Science / Science now Science now 367(6484), 1340 (2020). doi:10.1126/science.aay6690

  19. Isaac, Nishchay A.; Schlag, Leslie; Reiprich, Johannes; Katzer, Simeon; Nahrstedt, Helene; Pezoldt, Jörg; Stauden, Thomas; Jacobs, Heiko O.

    Gas Phase Electrodeposition Enabling the Programmable Three-Dimensional Growth of a Multimodal Room Temperature Nanobridge Gas Sensor Array

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    American Chemical Society (ACS), 2019

    Published in: ACS Applied Materials & Interfaces

  20. Kaltwasser, Mahsa; Schmidt, Udo; Biswas, Shantonu; Reiprich, Johannes; Schlag, Leslie; Isaac, Nishchay Angel; Stauden, Thomas; Jacobs, Heiko O.

    Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects

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    American Chemical Society (ACS), 2018

    Published in: ACS Applied Materials & Interfaces