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Kahng, Andrew B. [Author]; Lienig, Jens [Author]; Markov, Igor L. [Author]

Chāodà guimó jichéng diànlù wùlǐ shèji : Cóng túféngé dào shixù shōuliǎn

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Běijing: Jixiè gōngyè chūbǎnshe, 2014

Published in: Guóji diànqi gōngchéng xiānjin jishù yi cóng
Kahng, Andrew B. [Other]; Lienig, Jens [Other]

VLSI physical design : from graph partitioning to timing closure

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Dordrecht; Heidelberg [u.a.]: Springer, 2011
Kahng, Andrew B. [Author]; Lienig, Jens [Author]; Markov, Igor L. [Author]; Hu, Jin [Author]

VLSI physical design : from graph partitioning to timing closure - [Second edition]

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Cham: Springer, [2022]
Kahng, Andrew B. [Organizer]; Garg, Siddharth [Editor] ; ACM/IEEE Workshop on Machine Learning for CAD 5. 2023 Snowbird, Utah, Institute of Electrical and Electronics Engineers, Institute of Electrical and Electronics Engineers, Association for Computing Machinery

2023 ACM/IEEE 5th Workshop on Machine Learning for CAD (MLCAD) : 10-13 Sept. 2023

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[Piscataway, NJ]: IEEE, 2023
Kahng, Andrew B. [Author] ; Association for Computing Machinery, ACM Special Interest Group on Design Automation

Proceedings of the 1997 international symposium on Physical design

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http://dl.acm.org/citation.cfm?id=267665

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New York, NY: ACM, 1997

Published in: ACM Digital Library- ACM Conferences
Kahng, Andrew B. [Author]; Lienig, Jens [Author]; Markov, Igor L. [Author]; Hu, Jin [Author]

VLSI Physical Design: From Graph Partitioning to Timing Closure - [2nd ed. 2022.]

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Cham: Springer International Publishing, 2022. ; Cham: Imprint: Springer, 2022.
Kahng, Andrew B.

Machine Learning for CAD/EDA: The Road Ahead

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Institute of Electrical and Electronics Engineers (IEEE), 2023

Published in: IEEE Design & Test
Kahng, Andrew B.

RETRACTED ARTICLE: AI system outperforms humans in designing floorplans for microchips

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Springer Science and Business Media LLC, 2021

Published in: Nature
Kahng, Andrew B.

Lithography-induced limits to scaling of design quality

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SPIE, 2014

Published in: SPIE Proceedings
Kahng, Andrew B.

Cost-driven mask strategies considering parametric yield, defectivity, and production volume

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SPIE-Intl Soc Optical Eng, 2011

Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS
Kahng, Andrew B.

Design for manufacturability: Then and now

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Institute of Electrical and Electronics Engineers (IEEE), 2011

Published in: IEEE Design & Test of Computers
Kahng, Andrew B.

The Future of Signoff

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Institute of Electrical and Electronics Engineers (IEEE), 2011

Published in: IEEE Design & Test of Computers
Kahng, Andrew B.

Product Futures

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Institute of Electrical and Electronics Engineers (IEEE), 2011

Published in: IEEE Design & Test of Computers
Kahng, Andrew B.

Roadmapping Power

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Institute of Electrical and Electronics Engineers (IEEE), 2011

Published in: IEEE Design & Test of Computers
Kahng, Andrew B.

Roads not taken

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Institute of Electrical and Electronics Engineers (IEEE), 2011

Published in: IEEE Design & Test of Computers
Kahng, Andrew B.

Scaling: More than Moore's law

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Institute of Electrical and Electronics Engineers (IEEE), 2010

Published in: IEEE Design & Test of Computers
Kahng, Andrew B.

When is 3D 2B?

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Institute of Electrical and Electronics Engineers (IEEE), 2010

Published in: IEEE Design & Test of Computers
Kahng, Andrew B.

Lithography and design in partnership: a new roadmap

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SPIE, 2008

Published in: Photomask Technology 2008
Kahng, Andrew B.

Performance-driven optical proximity correction for mask cost reduction

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SPIE-Intl Soc Optical Eng, 2007

Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS
Kahng, Andrew B.

Design-process integration and shared red bricks

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SPIE, 2002

Published in: SPIE Proceedings

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