Media type: Book Title: Wafer bonding technology Contributor: Chen, Kuan-Neng [Editor]; Tan, Chuan Seng [Editor] Published: Singapore; Hackensack (New Jersey); London: World Scientific Publishing Co. Pte. Ltd., [2020] Published in: Encyclopedia of packaging materials, processes, and mechanics ; 1,4 Extent: x, 324 Seiten; Illustrationen, Diagramme Language: English ISBN: 9811201153; 9789811201158 RVK notation: ZN 4192 : Technologie diskreter Bauelemente (Bonden; Gehäuse); Packaging Origination: Footnote: Literaturangaben
Departmental Library DrePunct – open access area Shelf-mark: ZN 4192 Z63-1,4 Item ID: 34980760 Status: Loanable