Wire bonding in microelectronics

Media type: Book

Title: Wire bonding in microelectronics

Contributor: Harman, George G. [Author]

imprint: New York, NY [u.a.]: McGraw-Hill, 2010

Issue: 3. ed. [fully updated]

Extent: XX, 426 S; Ill., graph. Darst; 1 CD-ROM (12 cm)

Language: English

ISBN: 007170101X; 9780071701013; 0071476237; 0071703349; 9780071476232; 9780071703345

RVK notation: ZN 4900 : Allgemeines
ZN 4192 : Technologie diskreter Bauelemente (Bonden; Gehäuse); Packaging

Keywords: Bonden > Mikroelektronik > Produktionskontrolle

Origination:

Footnote: Auf der CD-ROM-Beil.: all the book's full-color figures plus animations. - Includes bibliographical references and index

Wire bonding in microelectronics - [3. ed. fully updated]