Media type: Book Title: Fundamentals of lead-free solder interconnect technology : from microstructures to reliability Contributor: Lee, Tae-Kyu [Other] imprint: New York; Heidelberg [u.a.]: Springer, 2015 Extent: XIII, 253 S.; Ill., graph. Darst Language: English ISBN: 9781461492658 RVK notation: ZN 4125 : Verbindungstechnik (Löten, Kontaktierung) Keywords: Electronics ; Systems engineering ; Optical materials ; Engineering Origination: Footnote:
Departmental Library DrePunct – open access area Shelf-mark: ZN 4125 L481 Item ID: 33154696 Status: Loanable