Media type: E-Article Title: Investigation of Electrical Contact Mechanism for Anisotropic Conductive Adhesive Joints After the Thermocompression Contributor: Lu, Su-Tsai; Chu, Han-Min; Chen, Wen-Hwa Published: Institute of Electrical and Electronics Engineers (IEEE), 2013 Published in: IEEE Transactions on Device and Materials Reliability, 13 (2013) 1, Seite 54-65 Language: Without Specification DOI: 10.1109/tdmr.2012.2210554 ISSN: 1530-4388; 1558-2574 Keywords: Electrical and Electronic Engineering ; Safety, Risk, Reliability and Quality ; Electronic, Optical and Magnetic Materials Origination: Footnote: