Media type: E-Article Title: Temperature and stress distribution in the SOI structure during fabrication Contributor: Cher Ming Tan; Zhenghao Gan; Xiaofang Gao imprint: Institute of Electrical and Electronics Engineers (IEEE), 2003 Published in: IEEE Transactions on Semiconductor Manufacturing Language: English DOI: 10.1109/tsm.2003.811886 ISSN: 0894-6507 Keywords: Electrical and Electronic Engineering ; Industrial and Manufacturing Engineering ; Condensed Matter Physics ; Electronic, Optical and Magnetic Materials Origination: Footnote: