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Ulm, 2023
Guo, Qingchuan
[Author];
Ghadiri, Reza
[Author];
Weigel, Thomas
[Author];
Aumann, Andreas
[Author];
Gurevich, Evgeny L.
[Author];
Esen, Cemal
[Author];
Medenbach, Olaf
[Author];
Cheng, Wei
[Author];
Chichkov, Boris
[Author];
Ostendorf, Andreas
[Author]
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Basel : MDPI AG, 2014
Published in:Polymers 6 (2014), Nr. 7
Guo, Qingchuan
[Author];
Ghadiri, Reza
[Author];
Weigel, Thomas
[Author];
Aumann, Andreas
[Author];
Gurevich, Evgeny L.
[Author];
Esen, Cemal
[Author];
Medenbach, Olaf
[Author];
Cheng, Wei
[Author];
Chichkov, Boris
[Author];
Ostendorf, Andreas
[Author]
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Freiburg im Breisgau, [2018?]
Bakhtina, Natalia A.
[Author]
;
Erscheint auch als$nDruck-Ausgabe!506126455!,
Albert-Ludwigs-Universität Freiburg Fakultät für Angewandte Wissenschaften
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Pittsburgh: International Microelectronics And Packaging Society (IMAPS), [2024]
Published in:IMAPSource Proceedings 2023 (ECMP)
Tang, Bo
[Author];
Bendas, Sebastian
[Author];
Constantinou, Iordania
[Author];
Dietzel, Andreas
[Author];
Krajka, Victor
[Author];
May, Tobias
[Author];
Moritz, Anke
[Author];
Reichl, Stephan
[Author]
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Freiburg im Breisgau, 2023
Luitz, Manuel
[Author];
Lunzer, Markus
[Author];
Goralczyk, Andreas
[Author];
Mader, Markus
[Author];
Bhagwat, Sagar
[Author];
Warmbold, Andreas
[Author];
Helmer, Dorothea
[Author];
Kotz-Helmer, Frederik
[Author];
Rapp, Bastian E.
[Author]