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Scheel, Wolfgang [Editor]

Innovative Produktionsprozesse für die Hochtemperatur-Elektronik am Beispiel der KFZ-Elektroniksysteme - [1. Aufl.]

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Templin: Detert, 2005

Published in: Buchreihe Aufbau- und Verbindungstechnik in der Elektronik - aktuelle Berichte ; 2
Reichl, Herbert [Editor] ; Mesago Messe Frankfurt, SMT Hybrid Packaging 2003 Nürnberg

Systemintegration in der Mikroelektronik : Messe & Kongress, Nürnberg, 6. - 8. Mai 2003 ; [Tagungsband] - [Elektronische Ressource]

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Berlin; Offenbach: VDE-Verl., 2003
Kirschman, Randall K. [Editor]

High-temperature electronics

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Piscataway, NY: IEEE Press, c 1999
Reichl, Herbert [Editor] ; Mesago Messe Frankfurt, SMT Hybrid Packaging 2003 Nürnberg

Systemintegration in der Mikroelektronik : Messe & Kongress, Nürnberg, 6. - 8. Mai 2003 ; [Tagungsband]

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Berlin; Offenbach: VDE-Verl., 2003
Heuck, Nicolas [Author]

Untersuchungen an silberbasierten Verbindungstechnologien für die Leistungs- und Hochtemperaturelektronik - [1. Aufl.]

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München: Dr. Hut, 2012

Published in: Elektronik
Czwienczek, Stefan [Author]

Hochtemperaturstabile Gießharze für die Elektrotechnik und Mikroelektronik

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https://d-nb.info/988279983/34

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Bajwa, Adeel Ahmad [Author]

New assembly and packaging technologies for high-power and high-temperature GaN and SiC devices

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2015
Grella, Katharina [Author] ; Vogt, Holger [Degree supervisor]; Hilleringmann, Ulrich [Degree supervisor]

Zuverlässigkeit von CMOS-Bauelementen auf SOI für den Betrieb bei 250 °C

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https://d-nb.info/1042899657/34

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Duisburg; Essen: Universitätsbibliothek Duisburg-Essen, 2013
Herfurth, Patrick [Author] ; Universität Ulm

Thin body InAlN/GaN HEMT technology on sapphire: special focus on high-temperature and electrochemical applications

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Ulm, 2016
Gorontzi, Kay [Author]

HTPAL : ein programmierbarer Logikbaustein für den Einsatz in Hochtemperaturanwendungen

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http://www.ub.uni-duisburg.de/ETD-db/theses/available/duett-01052004-155059/

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Herfurth, Patrick [Author]

Thin body InAlN/GaN HEMT technology on sapphire: special focus on high-temperature and electrochemical applications

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Ulm: Universität Ulm. Fakultät für Ingenieurwissenschaften und Informatik, 2016
Sharif, Ahmed [Editor]

Harsh environment electronics : interconnect materials and performance assessment

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https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964

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Weinheim: Wiley-VCH Verlag GmbH & Co. KGaA, [2019]

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