> Verlagsreihe
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23:
CAE/CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas sponsored by the Electrical and Electronic Packaging Division, ASME. Ed. by Dereje Agonafer
New York, NY: American Society of Mechanical Engineers, 1997
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20:
Application of fracture mechanics in electronic packaging [contains 23 technical papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging] ; presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas sponsored by the Applied Mechanics Division, ASME... Ed. by William T. Chen
New York, NY: American Soc. of Mechanical Engineers, 1997
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22:
Applications of experimental mechanics to electronic packaging - 1997 presented at the 1997 ASME internat. mechanical engineering congress and exposition, Dallas, Tex., Nov. 16 - 21, 1997 ed. by J. C. Suhling
New York, NY: American Society of Mechanical Engineers, 1997