> Verlagsreihe
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Volume 57:
3D microelectronic packaging from fundamentals to applications Yan Li, Deepak Goyal, editors
Cham, Springer International Publishing AG, [2017]
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Volume 40:
Flash memories economic principles of performance, cost and reliability optimization Detlev Richter
Dordrecht, Springer, 2014
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35:
Electromagnetic vibration energy harvesting devices architectures, design, modeling and optimization Dirk Spreemann; Yiannos Manoli
Dordrecht, Heidelberg [u.a.], Springer, 2012
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30:
Advanced materials for thermal management of electronic packaging Xingcun Colin Tong
New York NY, Heidelberg [u.a.], Springer, 2011
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29:
Time-to-digital converters Stephan Henzler
Dordrecht, Heidelberg [u.a.], Springer, 2010
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10:
Lock-in thermography basics and use for evaluating electronic devices and materials O. Breitenstein; Wilhelm Warta; Martin Langenkamp
Berlin, Heidelberg, Springer, 2010
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20:
Low power VCO design in CMOS Marc Tiebout
Berlin, Heidelberg [u.a.], Springer, 2006
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23:
Highly sensitive optical receivers K. Schneider; H. Zimmermann
Berlin, Heidelberg [u.a.], Springer, 2006
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22:
Detection and signal processing technical realization W. J. Witteman
Berlin, Heidelberg [u.a.], Springer, 2006
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24:
Bonding in microsystem technology J. A. Dziuban
Berlin [u.a.], Springer Netherland, 2006
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19:
Gettering defects in semiconductors V. A. Perevostchikov; V. D. Skoupov. [Transl.: Victor Gloumov]
Berlin, Heidelberg, New York, Springer, 2005
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18:
Microcontrollers in practice with 34 tables M. Mitescu; I. Susnea
Berlin, Heidelberg [u.a.], Springer, 2005
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16:
High dielectric constant materials VLSI MOSFET Applications; ... 31 tables H. R. Huff ... (eds.)
Berlin, Heidelberg [u.a.], Springer, 2005
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13:
Silicon optoelectronic integrated circuits with 19 tables Horst Zimmermann
Berlin, Heidelberg [u.a.], Springer, 2004
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14:
Integrated CMOS circuits for optical communications M. Ingels; M. Steyaert
Berlin, Heidelberg [u.a.], Springer, 2004
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10:
Lock-in thermography basics and use for functional diagnostics of electronic components O. Breitenstein; M. Langenkamp
Berlin, Heidelberg [u.a.], Springer, 2003
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12:
Current sense amplifiers for embedded SRAM in high performance system on a chip designs B. Wicht
Berlin, Heidelberg [u.a.], Springer, 2003
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9:
Low dielectric constant materials for IC applications P. S. Ho ... (eds.)
Berlin, Heidelberg [u.a.], Springer, 2003
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11:
High-frequency bipolar transistors physics, modeling, applications M. Reisch
Berlin, Heidelberg [u.a.], Springer, 2003
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6:
Smart power ICs technologies and applications B. Murari ... (eds.) Contributions by Andreini A
Berlin, Heidelberg [u.a.], Springer, 2002
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8:
Logic synthesis for asynchronous controllers and interfaces J. Cortadella
Berlin, Heidelberg [u.a.], Springer, 2002
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5:
VLSI memory chip design Kiyoo Itoh
Berlin, Heidelberg [u.a.], Springer, 2001
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7:
Noise in semiconductor devices modeling and simulation Fabrizio Bonani; Giovanni Ghione
Berlin, Heidelberg [u.a.], Springer, 2001
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4:
Microwave resonators and filters for wireless communication theory, design and application M. Makimoto; S. Yamashita
Berlin, Heidelberg [u.a.], Springer, 2001
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3:
Ferroelectric memories J. F. Scott
New York , Berlin, Heidelberg, Springer, 2000
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2:
Technology of integrated circuits D. Widmann; H. Mader
Berlin, Heidelberg [u.a.], Springer, 2000
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1:
Cellular neural networks chaos, complexity and VLSI processing G. Manganaro; P. Arena; L. Fortuna
Berlin, Heidelberg, New York [u.a.], Springer, 1999