> Verlagsreihe
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3D microelectronic packaging from fundamentals to applications Yan Li, Deepak Goyal, editors
Cham: Springer International Publishing AG, [2017]
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Flash memories economic principles of performance, cost and reliability optimization Detlev Richter
Dordrecht: Springer, 2014
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Electromagnetic vibration energy harvesting devices architectures, design, modeling and optimization Dirk Spreemann; Yiannos Manoli
Dordrecht, Heidelberg [u.a.]: Springer, 2012
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Advanced materials for thermal management of electronic packaging Xingcun Colin Tong
New York NY; Heidelberg [u.a.]: Springer, 2011
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Lock-in thermography basics and use for evaluating electronic devices and materials O. Breitenstein; Wilhelm Warta; Martin Langenkamp
Berlin; Heidelberg: Springer, 2010
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Time-to-digital converters Stephan Henzler
Dordrecht; Heidelberg [u.a.]: Springer, 2010
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Highly sensitive optical receivers K. Schneider; H. Zimmermann
Berlin; Heidelberg [u.a.]: Springer, 2006
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Low power VCO design in CMOS Marc Tiebout
Berlin; Heidelberg [u.a.]: Springer, 2006
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Detection and signal processing technical realization W. J. Witteman
Berlin; Heidelberg [u.a.]: Springer, 2006
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Bonding in microsystem technology J. A. Dziuban
Berlin [u.a.]: Springer Netherland, 2006
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Microcontrollers in practice with 34 tables M. Mitescu; I. Susnea
Berlin; Heidelberg [u.a.]: Springer, 2005
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Gettering defects in semiconductors V. A. Perevostchikov; V. D. Skoupov. [Transl.: Victor Gloumov]
Berlin; Heidelberg; New York: Springer, 2005
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High dielectric constant materials VLSI MOSFET Applications; ... 31 tables H. R. Huff ... (eds.)
Berlin; Heidelberg [u.a.]: Springer, 2005
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Integrated CMOS circuits for optical communications M. Ingels; M. Steyaert
Berlin; Heidelberg [u.a.]: Springer, 2004
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Silicon optoelectronic integrated circuits with 19 tables Horst Zimmermann
Berlin; Heidelberg [u.a.]: Springer, 2004
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Low dielectric constant materials for IC applications P. S. Ho ... (eds.)
Berlin; Heidelberg [u.a.]: Springer, 2003
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Current sense amplifiers for embedded SRAM in high performance system on a chip designs B. Wicht
Berlin; Heidelberg [u.a.]: Springer, 2003
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Lock-in thermography basics and use for functional diagnostics of electronic components O. Breitenstein; M. Langenkamp
Berlin; Heidelberg [u.a.]: Springer, 2003
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High-frequency bipolar transistors physics, modeling, applications M. Reisch
Berlin; Heidelberg [u.a.]: Springer, 2003
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Logic synthesis for asynchronous controllers and interfaces J. Cortadella
Berlin; Heidelberg [u.a.]: Springer, 2002
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Smart power ICs technologies and applications B. Murari ... (eds.) Contributions by Andreini A
Berlin; Heidelberg [u.a.]: Springer, 2002
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VLSI memory chip design Kiyoo Itoh
Berlin; Heidelberg [u.a.]: Springer, 2001
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Microwave resonators and filters for wireless communication theory, design and application M. Makimoto; S. Yamashita
Berlin; Heidelberg [u.a.]: Springer, 2001
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Noise in semiconductor devices modeling and simulation Fabrizio Bonani; Giovanni Ghione
Berlin; Heidelberg [u.a.]: Springer, 2001
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Technology of integrated circuits D. Widmann; H. Mader
Berlin; Heidelberg [u.a.]: Springer, 2000
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Ferroelectric memories J. F. Scott
New York , Berlin; Heidelberg: Springer, 2000
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Cellular neural networks chaos, complexity and VLSI processing G. Manganaro; P. Arena; L. Fortuna
Berlin; Heidelberg; New York [u.a.]: Springer, 1999