Skip to contents Lau, John H. [Other] Electronic packaging : design, materials, process, and reliability Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York; London [u.a.]: McGraw-Hill, 1998 Published in: Electronic packaging and interconnection series Lau, John H. [Editor] Handbook of tape automated bonding Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, N.Y.: Van Nostrand Reinhold u.a., 1992 Matisoff, Bernard S. [Author] Handbook of electronics packaging design and engineering - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York: Van Nostrand Reinhold, 1990 Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis - [Third edition] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton; London; New York: CRC Press, Taylor & Francis Group, [2016] Published in: Engineering - electrical Licari, James J. [Author]; Swanson, Dale W. [Author] Adhesives technology for electronic applications : materials, processing, reliability - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Walham, Mass. [u.a.]: William Andrew, 2011 ; Amsterdam; Heidelberg [u.a.]: Elsevier, Andrew, 2011 Published in: Materials and processes for electronic applications series Pecht, Michael [Other] Electronic packaging materials and their properties Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton, Fla. [u.a.]: CRC Press, c1999 Published in: The Electronic packaging series Dally, James W. [Author]; Lall, Pradeep [Author]; Suhling, Jeffrey C. [Author] Mechanical design of electronic sytems Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Knoxville, Tennessee: College House Enterprises, LLC, [2008] Lau, John H. [Editor] Chip on board technologies for multichip modules Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York; Bonn [u.a.]: Van Nostrand Reinhold, 1994 Tummala, Rao R. [Editor] Fundamentals of microsystems packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY [u.a.]: McGraw-Hill, 2001 Published in: Electronics engineering Steinbrüchel, Christoph [Author]; Chin, Barry L. [Author] Copper interconnect technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Bellingham, Wash.: SPIE Optical Engineering Press, c2001 Published in: Tutorial texts in optical engineering ; 46 Wong, C. P. [Editor]; Moon, Kyoung-Sik [Other]; Li, Yi [Other] Nano-bio-electronic, photonic and MEMS packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY; Heidelberg [u.a.]: Springer, 2010 Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton, Fla. [u.a.]: CRC Press, 2009 Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York [u.a.]: Marcel Dekker, 2003 Published in: Mechanical engineering ; 14600 Tummala, Rao R. [Editor] ; Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics 1997 Bled Electronic packaging for high reliability, low cost elctronics : [proceedings of the NATO Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics, Bled, Slovenia, May 10 - 13, 1997] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dordrecht [u.a.]: Kluwer Acad. Publ., 1999 Published in: NATO: NATO ASI series / Partnership sub-series / 3 ; 57 Martens, Luc [Author] High-frequency characterization of electronic packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boston, Mass. [u.a.]: Kluwer Academic Publishers, 1998 Published in: Electronic packaging and interconnects series Hoffmann, Thomas [Author] Miniaturisierung auf Baugruppenebene Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Heidelberg: Hüthig, 1992 Published in: Mikroelektronik ; 900 Lee, Y. C. [Other]; Chen, W. T. [Other]; Lee, Yung-Cheng [Editor] Manufacturing challenges in electronic packaging - [1. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. London; Weinheim [u.a.]: Chapman & Hall, 1998 Harman, George G. [Author] Wire bonding in microelectronics - [3. ed. fully updated] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY [u.a.]: McGraw-Hill, 2010 Harman, George G. [Author] Wire bonding in microelectronics : materials, processes, reliability, and yield - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY [u.a.]: McGraw-Hill, 1997 Published in: Electronic packaging and interconnection series Villanucci, Robert S. [Author]; Avtgis, Alexander W. [Author]; Megow, William F. [Author] Electronic techniques : shop practices and construction Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Englewood Cliffs, N.J: Prentice-Hall, 1974 Published in: Prentice-Hall series in electronic technology
Lau, John H. [Other] Electronic packaging : design, materials, process, and reliability Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York; London [u.a.]: McGraw-Hill, 1998 Published in: Electronic packaging and interconnection series
Lau, John H. [Editor] Handbook of tape automated bonding Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, N.Y.: Van Nostrand Reinhold u.a., 1992
Matisoff, Bernard S. [Author] Handbook of electronics packaging design and engineering - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York: Van Nostrand Reinhold, 1990
Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis - [Third edition] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton; London; New York: CRC Press, Taylor & Francis Group, [2016] Published in: Engineering - electrical
Licari, James J. [Author]; Swanson, Dale W. [Author] Adhesives technology for electronic applications : materials, processing, reliability - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Walham, Mass. [u.a.]: William Andrew, 2011 ; Amsterdam; Heidelberg [u.a.]: Elsevier, Andrew, 2011 Published in: Materials and processes for electronic applications series
Pecht, Michael [Other] Electronic packaging materials and their properties Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton, Fla. [u.a.]: CRC Press, c1999 Published in: The Electronic packaging series
Dally, James W. [Author]; Lall, Pradeep [Author]; Suhling, Jeffrey C. [Author] Mechanical design of electronic sytems Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Knoxville, Tennessee: College House Enterprises, LLC, [2008]
Lau, John H. [Editor] Chip on board technologies for multichip modules Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York; Bonn [u.a.]: Van Nostrand Reinhold, 1994
Tummala, Rao R. [Editor] Fundamentals of microsystems packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY [u.a.]: McGraw-Hill, 2001 Published in: Electronics engineering
Steinbrüchel, Christoph [Author]; Chin, Barry L. [Author] Copper interconnect technology Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Bellingham, Wash.: SPIE Optical Engineering Press, c2001 Published in: Tutorial texts in optical engineering ; 46
Wong, C. P. [Editor]; Moon, Kyoung-Sik [Other]; Li, Yi [Other] Nano-bio-electronic, photonic and MEMS packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY; Heidelberg [u.a.]: Springer, 2010
Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boca Raton, Fla. [u.a.]: CRC Press, 2009
Jamnia, Ali [Author] Practical guide to the packaging of electronics : thermal and mechanical design and analysis Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York [u.a.]: Marcel Dekker, 2003 Published in: Mechanical engineering ; 14600
Tummala, Rao R. [Editor] ; Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics 1997 Bled Electronic packaging for high reliability, low cost elctronics : [proceedings of the NATO Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics, Bled, Slovenia, May 10 - 13, 1997] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Dordrecht [u.a.]: Kluwer Acad. Publ., 1999 Published in: NATO: NATO ASI series / Partnership sub-series / 3 ; 57
Martens, Luc [Author] High-frequency characterization of electronic packaging Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Boston, Mass. [u.a.]: Kluwer Academic Publishers, 1998 Published in: Electronic packaging and interconnects series
Hoffmann, Thomas [Author] Miniaturisierung auf Baugruppenebene Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Heidelberg: Hüthig, 1992 Published in: Mikroelektronik ; 900
Lee, Y. C. [Other]; Chen, W. T. [Other]; Lee, Yung-Cheng [Editor] Manufacturing challenges in electronic packaging - [1. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. London; Weinheim [u.a.]: Chapman & Hall, 1998
Harman, George G. [Author] Wire bonding in microelectronics - [3. ed. fully updated] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY [u.a.]: McGraw-Hill, 2010
Harman, George G. [Author] Wire bonding in microelectronics : materials, processes, reliability, and yield - [2. ed.] Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. New York, NY [u.a.]: McGraw-Hill, 1997 Published in: Electronic packaging and interconnection series
Villanucci, Robert S. [Author]; Avtgis, Alexander W. [Author]; Megow, William F. [Author] Electronic techniques : shop practices and construction Books Close > Bookmarks You can manage bookmarks using lists, please log in to your user account for this. Englewood Cliffs, N.J: Prentice-Hall, 1974 Published in: Prentice-Hall series in electronic technology
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